Latest research report on “3D Time-of-flight Image Sensors Market” now available at high quality database of ReportsnReports.com with market size, share, trends, competitive and statistical analysis. An exclusive data offered in this report is collected by research and industry experts team.
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3D time-of-flight (ToF) sensor is part of the 3D ToF image sensor family. The device combines ToF sensing with an optimally-designed analog-to-digital converter (ADC) and a versatile, programmable timing generator (TG).
The built-in TG controls the reset, modulation, readout, and digitization sequence. The programmability of the TG offers flexibility to optimize for various depth-sensing performance.
This report contains market size and forecasts of 3D Time-of-flight Image Sensors in global, including the following market information:
Global 3D Time-of-flight Image Sensors Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global 3D Time-of-flight Image Sensors Market Sales, 2017-2022, 2023-2028, (K Units)
Global top five 3D Time-of-flight Image Sensors companies in 2021 (%)
The global 3D Time-of-flight Image Sensors market was valued at 1457 million in 2021 and is projected to reach US$ 4964.3 million by 2028, at a CAGR of 19.1% during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Half-QVGA ToF Image Sensor Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of 3D Time-of-flight Image Sensors include Texas Instruments, STMicroelectronics, PMD Technologies, Infineon, PrimeSense (Apple), MESA (Heptagon), Melexis, ifm Electronic and Canesta (Microsoft), etc. In 2021, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the 3D Time-of-flight Image Sensors manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global 3D Time-of-flight Image Sensors Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global 3D Time-of-flight Image Sensors Market Segment Percentages, by Type, 2021 (%)
– Half-QVGA ToF Image Sensor
– QVGA ToF Image Sensor
– Others
Global 3D Time-of-flight Image Sensors Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global 3D Time-of-flight Image Sensors Market Segment Percentages, by Application, 2021 (%)
– Consumer Electronics
– Robotics and Drone
– Machine Vision and Industrial Automation
– Entertainment
– Automobile
– Others
Global 3D Time-of-flight Image Sensors Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (K Units)
Global 3D Time-of-flight Image Sensors Market Segment Percentages, By Region and Country, 2021 (%)
– North America
– – US
– – Canada
– – Mexico
– Europe
– – Germany
– – France
– – U.K.
– – Italy
– – Russia
– – Nordic Countries
– – Benelux
– – Rest of Europe
– Asia
– – China
– – Japan
– – South Korea
– – Southeast Asia
– – India
– – Rest of Asia
– South America
– – Brazil
– – Argentina
– – Rest of South America
– Middle East & Africa
– – Turkey
– – Israel
– – Saudi Arabia
– – UAE
– – Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies 3D Time-of-flight Image Sensors revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies 3D Time-of-flight Image Sensors revenues share in global market, 2021 (%)
Key companies 3D Time-of-flight Image Sensors sales in global market, 2017-2022 (Estimated), (K Units)
Key companies 3D Time-of-flight Image Sensors sales share in global market, 2021 (%)
Further, the report presents profiles of competitors in the market, key players include:
– Texas Instruments
– STMicroelectronics
– PMD Technologies
– Infineon
– PrimeSense (Apple)
– MESA (Heptagon)
– Melexis
– ifm Electronic
– Canesta (Microsoft)
– Espros Photonics
– TriDiCam
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