A fresh report titled Thermal Management Market delivering key insights and providing a competitive advantage to clients through a detailed report. The report contains 173 pages which highly exhibit on current market analysis scenario, upcoming as well as future opportunities, revenue growth, pricing and profitability. An exclusive data offered in this report is collected by research and industry experts team.
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The Thermal Management Market is expected to grow from US$ 11.1 Billion in 2019 to US$ 16.2 Billion by 2024, at a CAGR of 8.0%.
Top Key Players profiled in the Thermal Management Market:
- Honeywell International Inc. (US)
- Aavid Thermalloy LLC. (US)
- Vertiv Co. (US)
- European Thermodynamics Ltd. (UK)
- Master Bond Inc. (US)
Nonadhesive materials such as thermal pads, gap fillers, and grease are used widely in consumer electronics such as computers, laptops, and other handheld devices such as tablets. Thermal pads are used to fill the gaps between heat sinks and microprocessors. They eliminate air gaps to reduce thermal resistance and provide low-stress vibration dampening. Elastomeric pads were developed as an alternative to grease-based solutions used earlier for thermal management.
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Convection cooling devices are increasingly being used in electronic components, electronic circuits, and PCBs. These devices help lower the peak temperature of different systems wherein they are installed with natural and forced convection cooling technologies. Devices such as loop heat pipes, heat pumps, heat sinks, and heat spreaders are used for effective cooling of processors and computers, among others.