Solder Ball Market report reviews advanced and sophisticated threats to boost growth 2022-2028

Latest research report on “Solder Ball Market” now available at high quality database of with market size, share, trends, competitive and statistical analysis. An exclusive data offered in this report is collected by research and industry experts team.

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In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as “ball” or “bumps”) is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.
Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.
The Solder Ball industry can be broken down into several segments, Lead Solder Ball and Lead Free Solder Ball.
Across the world, the major players cover Senju Metal, DS HiMetal, etc.
This report contains market size and forecasts of Solder Ball in global, including the following market information:
Global Solder Ball Market Revenue, 2017-2022, 2023-2028, ($ millions)
Global Solder Ball Market Sales, 2017-2022, 2023-2028, (M Units)
Global top five Solder Ball companies in 2021 (%)
The global Solder Ball market was valued at 259.5 million in 2021 and is projected to reach US$ 395.9 million by 2028, at a CAGR of 6.2% during the forecast period.
The U.S. Market is Estimated at $ Million in 2021, While China is Forecast to Reach $ Million by 2028.
Lead Solder Ball Segment to Reach $ Million by 2028, with a % CAGR in next six years.
The global key manufacturers of Solder Ball include Senju Metal, Accurus, DS HiMetal, NMC, MKE, PMTC, Indium Corporation, YCTC and Shenmao Technology and etc. In 2021, the global top five players have a share approximately % in terms of revenue.

MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Solder Ball manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.

Total Market by Segment:
Global Solder Ball Market, by Type, 2017-2022, 2023-2028 ($ Millions) & (M Units)
Global Solder Ball Market Segment Percentages, by Type, 2021 (%)
– Lead Solder Ball
– Lead Free Solder Ball
Global Solder Ball Market, by Application, 2017-2022, 2023-2028 ($ Millions) & (M Units)
Global Solder Ball Market Segment Percentages, by Application, 2021 (%)
– Flip-Chip & Others
Global Solder Ball Market, By Region and Country, 2017-2022, 2023-2028 ($ Millions) & (M Units)
Global Solder Ball Market Segment Percentages, By Region and Country, 2021 (%)
– North America
– – US
– – Canada
– – Mexico
– Europe
– – Germany
– – France
– – U.K.
– – Italy
– – Russia
– – Nordic Countries
– – Benelux
– – Rest of Europe
– Asia
– – China
– – Japan
– – South Korea
– – Southeast Asia
– – India
– – Rest of Asia
– South America
– – Brazil
– – Argentina
– – Rest of South America
– Middle East & Africa
– – Turkey
– – Israel
– – Saudi Arabia
– – UAE
– – Rest of Middle East & Africa

Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Solder Ball revenues in global market, 2017-2022 (Estimated), ($ millions)
Key companies Solder Ball revenues share in global market, 2021 (%)
Key companies Solder Ball sales in global market, 2017-2022 (Estimated), (M Units)
Key companies Solder Ball sales share in global market, 2021 (%)

Further, the report presents profiles of competitors in the market, key players include:
– Senju Metal
– Accurus
– DS HiMetal
– Indium Corporation
– Shenmao Technology
– Shanghai hiking solder material

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